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Bulletin of Chinese Academy of Sciences (Chinese Version)

Keywords

semiconductor equipment; integrated circuits; path innovation; re-globalization; industrial ecology

Document Type

Current Landscape and Future Perspectives of High-end Manufacturing

Abstract

During the “15th Five-Year Plan”, China’s semiconductor equipment industry is facing the dual challenges of technological blockade and supply chain decoupling. It needs to shift from “catching up and replacing” to “path innovation” to break through its dependence on the international technology system. This study analyzes three core needs: supporting self-reliance (breaking through the bottleneck of advanced process equipment and parts), building an innovation ecosystem with Chinese characteristics (exploring new technology paths such as GAA and 3D integration), and promoting intelligent upgrading (integrating AI and digital technology). At the same time, it proposes to use the strategy of “re-globalization” to deal with counter-globalization, and reshape the global semiconductor industry chain through the synergy of the internal cycle and the international double cycle. At present, domestic equipment has made breakthroughs in mature processes, but the high-end field is still monopolized by the United States, Japan and Europe, and faces problems such as low-level repeated competition and “stuck necks” in the supply chain. It is recommended to avoid internal entanglements through systematic scientific and technological research and collaborative innovation between upstream and downstream, focus on asymmetric technological advantages, and realize the leap from autonomous and controllable to self-reliance and self-improvement.

First page

844

Last Page

851

Language

Chinese

Publisher

Bulletin of Chinese Academy of Sciences

References

1 曹健林. 新质生产力与高端装备制造：问题、思考与实践. 中国科学院院刊, 2024, 39(9): 1557-1563. Cao J L. Emerging productivity and advanced equipment manufacturing: Issues, reflections, and practices. Bulletin of Chinese Academy of Sciences, 2024, 39(9): 1557-1563. (in Chinese)

2 曹健林. 把先进装备制造话语权，牢牢掌握自己手中. 佛山：季华实验室， 2024. Cao J L. Take the right to speak on advanced equipment manufacturing firmly in your own hands. Foshan: Ji Hua Laboratory, 2024. (in Chinese)

3 丁熠，刘佳甲，何鹏程. 集成电路制造装备发展现状及展望. 电子工艺技术, 2024, 45(4): 1-5. Ding Y, Liu J J, He P C. Development status and prospect of integrated circuit manufacturing equipment. Electronics Process Technology, 2024, 45(4): 1-5. (in Chinese)

4 周哲, 付丙磊, 董天波, 等. 半导体工艺与制造装备技术发展趋势. 电子工业专业设备, 2022, 295: 1-8. Zhou Z, Fu B L, Dong T B, et al. The development of semiconductor process and its manufacturing equipment technologies. Equipment for Electronic Products Manufacturing, 2022, 295: 1-8. (in Chinese)

5 曹健林. 走出一条中国芯片创新之路. 中国政协, 2024, 16: 54-55. Cao J L. Stepping out of a road of Chinese chip innovation. CPPCC of China, 2024, 16: 54-55. (in Chinese)

6 张国铭. 智能化时代，国产集成电路制造装备发展的新机遇. 集成电路应用, 2018, 35(1): 55-56. Zhang G M. New opportunities for the development of domestic integrated circuit manufacturing equipment in the time of intelligence. Application of IC, 2018, 35(1): 55-56. (in Chinese)

7 朱晶. 半导体零部件产业现状及对我国发展的建议. 中国集成电路, 2022, 31(4): 10-17. Zhu J. The Current Status of Semiconductor Parts Industry and Suggestions for China. IC of China, 2022, 31(4): 10-17. (in Chinese)

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