Bulletin of Chinese Academy of Sciences (Chinese Version)
Keywords
chip; integrated circuit (IC); electronics design automation (EDA); digital economy; talent training
Document Type
S&T Forefront and Emerging Productivity
Abstract
As the cornerstone of the digital economy in the information age, the essence of integrated circuit (IC) chips is to represent and process information by using physical phenomena. The IC challenges faced by China are not only in the field of fabrication, but also in the fields of electronics design automation (EDA) and talent training. Based on a review of the background and current situations of IC technologies, this study analyzes advantages, issues that need attention, and potential areas of technological breakthrough in the Guangdong-Hong Kong-Macao Greater Bay Area.
First page
1612
Last Page
1618
Language
Chinese
Publisher
Bulletin of Chinese Academy of Sciences
References
1 Palma R, Varadarajan R, Goodrich J, et al. The Growing Challenge of Semiconductor Design Leadership. (2022-11-30)[2024-07-20]. https://www.bcg.com/publications/2022/the-challenges-of-semiconductor-design-space.
2 Grassano N, Hernandez Guevara H, Fako P, et al. The 2022 EU Industrial R&D Investment Scoreboard. (2022-12-13)[2024-07-20]. https://iri.jrc.ec.europa.eu/scoreboard/2022-eu-industrial-rd-investment-scoreboard.
3 中国电子信息产业发展研究院. 中国集成电路产业人才发展报告. 北京: 中国电子信息产业发展研究院, 2022.China Electronic Information Industry Development Research Institute. China Integrated Circuit Industry Talent Development Report. Beijng: China Electronic Information Industry Development Research Institute, 2022. (in Chinese)
4 Moore G. Cramming more components onto integrated circuits. Electronics, 1965, 38(8): 114-117.
5 Wang Z H, Wang Z F, Xu J, et al. CAMON: Low-cost silicon photonic chiplet for manycore processors. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2020, 39(9): 1820-1833.
Recommended Citation
XU, Jiang and ZHANG, Wei
(2024)
"Cornerstone of digital economy: Challenges and opportunities of IC technologies,"
Bulletin of Chinese Academy of Sciences (Chinese Version): Vol. 39
:
Iss.
9
, Article 14.
DOI: https://doi.org/10.16418/j.issn.1000-3045.20240715001
Available at:
https://bulletinofcas.researchcommons.org/journal/vol39/iss9/14
Included in
Development Studies Commons, Electronic Devices and Semiconductor Manufacturing Commons, Science and Technology Policy Commons