•  
  •  
 

Bulletin of Chinese Academy of Sciences (Chinese Version)

Keywords

modern industrial system; science and technology innovation; industrial innovation; deep integration; extreme ultra-violet (EUV) lithography

Document Type

S&T Innovation Leads Modern Industrial System Construction

Abstract

Utilizing technological innovation to lead the construction of a modern industrial system is a strategic choice for seizing the opportunities of the new round of technological revolution and industrial transformation. It is also a necessary step for winning the strategic initiative towards high-level self-reliance and self-improvement. Technological innovation is the intrinsic driving force behind industrial innovation, and industrial innovation is the value embodiment of technological innovation. The deep integration of technological innovation and industrial innovation is the key to constructing and improving a modern industrial system. Taking the global extreme ultra-violet (EUV) lithography system as an example, based on the perspective of the innovation chain, this study explores the breakthrough of EUV lithography system from four stages: applied basic research–applied research–pilot scale-up–large scale production. It refines the process of the formation of closely dynamic deep integration of technological innovation and industrial innovation from aspects such as diversified main bodies collaborating to strengthen application-oriented technological innovation supply to enhance the advancement of the technical system, leading enterprises leading to break through the industrial chain resources to promote the integrity of the supply system, and innovative institutional design ensuring the output transformation of achievements to enhance the dynamic nature of the innovation system. This provides theoretical and practical insights for China to seize the commanding heights of global science and technology and build modern industrial systems, as well as develop new quality productivity.

First page

1141

Last Page

1152

Language

Chinese

Publisher

Bulletin of Chinese Academy of Sciences

References

1 张学文, 陈劲. 科技自立自强的理论、战略与实践逻辑. 科学学研究, 2021, 39(5): 769-770.Zhang X W, Chen J. Theory, strategy and practical logic of self-reliance and self-improvement. Studies in Science of Science, 2021, 39(5): 769-770. (in Chinese)

2 孙琴, 刘戒骄, 胡贝贝. 关键核心技术突破能力建设需求分析. 科研管理, 2024, 45(3): 31-41.Sun Q, Liu J J, Hu B B. An analysis of the needs for building the key core technology breakthrough capabilities. Science Research Management, 2024, 45(3): 31-41. (in Chinese)

3 刘雯, 马晓辉, 刘武. 中国大陆集成电路产业发展态势与建议. 中国软科学, 2015, (11): 186-192.Liu W, Ma X H, Liu W. Development trend of IC industry in the China’s mainland and some recommendations. China Soft Science, 2015, (11): 186-192. (in Chinese)

4 曾海峰, 郭磊, 李世光, 等. 从极紫外光刻发展看全球范围内的技术合作. 激光技术, 2023, 47(1): 1-12.Zeng H F, Guo L, Li S G, et al. Global technical cooperation from the perspective of extreme ultraviolet lithography development. Laser Technology, 2023, 47(1): 1-12. (in Chinese)

5 Bakshi V. EUV Lithography. Washington DC: SPIE Press, 2009: 63-65.

6 Linden G, Mowery D C, Ham Ziedonis R. National technology policy in global markets: Developing next-generation lithography in the semiconductor industry. Business and Politics, 2000, 2(2): 93-113.

7 渠慎宁, 杨丹辉, 兰明昊. 高端芯片制造存在“小院高墙”吗：理论解析与中国突破路径模拟. 中国工业经济, 2023, (6): 62-80.Qu S N, Yang D H, Lan M H. Does there exist “small-yard and high-fence” in high-end chip manufacturing: Theoretical analysis and simulation of China’s breakthrough path. China Industrial Economics, 2023, (6): 62-80. (in Chinese)

8 余江, 刘佳丽, 甘泉, 等. 以跨学科大纵深研究策源重大原始创新：新一代集成电路光刻系统突破的启示. 中国科学院院刊, 2020, 35(1): 112-117.Yu J, Liu J L, Gan Q, et al. Major original innovation based on interdisciplinary research: International insights from breakthrough of new generation of lithography system. Bulletin of Chinese Academy of Sciences, 2020, 35(1): 112-117. (in Chinese)

9 柳卸林, 常馨之, 董彩婷. 构建创新生态系统,实现核心技术突破性创新：以IMEC在集成电路领域创新实践为例. 科学学与科学技术管理, 2021, 42(9): 3-18.Liu X L, Chang X Z, Dong C T. Build an ecosystem, realize breakthrough innovation in core technology fields: Take IMEC’s practice in the semiconductor field as an example. Science of Science and Management of S & T, 2021, 42(9): 3-18. (in Chinese)

10 柳卸林, 常馨之. 构建市场导向的核心技术创新生态系统. 科学学研究, 2024, 42(3): 614-623.Liu X L, Chang X Z. Building a market-oriented innovation ecosystem for core technologies. Studies in Science of Science, 2024, 42(3): 614-623. (in Chinese)

11 Moreau W M. Semiconductor Lithography: Principles, Practices, and Materials. Berlin: Springer Science & Business Media, 2012.

12 Raaijmakers R. ASML’s Architects: The Story of the Engineers who Shaped the World’s Most Powerful Chip Machines. Nijmegen: Techwatch, 2019.

13 牛惠敏, 房超. 比较视阈下政府—科研机构—企业关系研究. 科学学研究, 2023, 41(10): 1833-1843.Niu H M, Fang C. A comparative study on the relationship between government, scientific research institutions and enterprises. Studies in Science of Science, 2023, 41(10): 1833-1843. (in Chinese)

Download
Request a Copy

Share

COinS