•  
  •  
 

Bulletin of Chinese Academy of Sciences (Chinese Version)

Keywords

China, chip, integrated circuit, semiconductor

Document Type

Avoid Middle-technology Trap and Achieve Chinese Path to Modernization

Abstract

Due to China’s great attention to and strong support for the chip industry, China’s chip technology level has made considerable progress. Nevertheless, compared with the United States, Europe, Japan, South Korea, and other countries, there is still a big gap. Specially, in the high-end chip product market, the scenario that China is subject to others has not been fundamentally changed. This study finds that to solve the stuck neck problem of China’s chip industry, it is needed to analyze internal institutional factors. China’s chip technology progress requires joint promotion from multiple actors, namely, government, enterprises, universities and research institutions to jointly promote. In the process of technological progress, these actors have different motives and face different institutional constraints, with such motives and collaboration, the technological progress could be effectively promoted. This study analyzes the obstacles in the process of impeding various actors to promote technological progress in detail. It is concluded that in order to achieve greater progress in China’s chip industrial technology, it is necessary to carry out more extensive and profound reforms, binding advantageous resources together to overcome technical problems, avoid resource waste, effectively use industrial policies, and put market-oriented enterprises at the core of the technological innovation system.

First page

1665

Last Page

1674

Language

Chinese

Publisher

Bulletin of Chinese Academy of Sciences

References

1 郭本海, 王鹏辉, 崔文海, 等. 考虑关键核心技术发展的我国集成电路产业政策效力研究. 科技进步与对策, 2023, 40(3): 41-51. Guo B H, Wang P H, Cui W H, et al. The policy effectiveness of China’s integrated circuit industry considering the development of key and core technologies. Science & Technology Progress and Policy, 2023, 40(3): 41-51. (in Chinese)

2 陈旭, 江瑶, 熊焰, 等. 基于专利维度的关键核心技术“卡脖子”问题识别与分析——以集成电路产业为例. 情报杂志, 2023, 42(8): 83-89. Chen X, Jiang Y, Xiong Y, et al. Identification and analysis of key core technology “neck” problem based on patent dimension: A case of the integrated circuit industry. Journal of Intelligence, 2023, 42(8): 83-89. (in Chinese)

3 周观平, 易宇. 新发展格局下提升中国集成电路产业链安全可控水平研究. 宏观经济研究, 2021, (11): 58-69. Zhou G P, Yi Y. A study on improving the security and control level of China’s IC industry chain under the new development pattern. Macroeconomics, 2021, (11): 58-69. (in Chinese)

4 张猛, 尹其其. 从华为中兴事件看我国芯片产业安全发展的问题与建议. 网络空间安全, 2020, 11(11): 57-60. Zhang M, Yin Q Q. Problems and suggestions of China’s chip industry security development from the perspective of Huawei and ZTE event. Cyberspace Security, 2020, 11(11): 57-60. (in Chinese)

5 秦耳. 国产28 nm、14 nm芯片量产将满足大部分市场需求. 数字经济, 2021， (5): 92-96. Qin E. Domestic 28 nm, 14 nm chip mass production will meet most of the market demand. Digital Economy, 2021, (5): 92-96. (in Chinese)

6 李晓光, 石丹. 中国芯片产业“烂尾”调查：谁为冲动买单. 商学院, 2020, (11): 9-15. Li X G, Shi D. China’s chip industry “rotten tail” investigation: Who pays for impulse? Business Management Review, 2020, (11): 9-15. (in Chinese)

7 郝杰. 谢志峰. 中国芯片产业需长远规划和长期投入. 中国经济评论, 2020, (4): 38-40. Hao J. Xie Z F. China’s chip industry needs long-term planning and investment. China Economic Review, 2020, (4): 38-40. (in Chinese)

8 张春. 关于国有企业科技创新工作的思考. 国有资产管理, 2021, (1): 29-31. Zhang C. Thoughts on the scientific and technological innovation work of state-owned enterprises. State Assets Management, 2021(1): 29-31. (in Chinese)

9 陈俊一. 千亿市值芯片公司的浮与沉. 中国工业和信息化, 2020, (11): 90-95. Chen J Y. Billions of market cap chip companies rise and fall. China Industry & Information Technology, 2020, (11): 90-95. (in Chinese)

10 步丹璐, 郁智. 政府补助给了谁：分布特征实证分析——基于2007—2010年中国上市公司的相关数据. 财政研究, 2012, (8): 58-63. Bu D L, Yu Z. Government subsidies to whom: Empirical analysis of distribution characteristics: Based on the relevant data of listed companies in China from 2007 to 2010. Public Finance Research, 2012, (8): 58-63. (in Chinese)

11 周寰. 改革体制机制, 调动国有企业科技创新积极性. 经济研究参考, 2011, (61): 72-74. Zhou H. Reform of the system and mechanism to arouse the enthusiasm of state-owned enterprises in scientific and technological innovation. Review of Economic Research, 2011, (61): 72-74. (in Chinese)

12 彭晓宏, 王胜霞, 耿淑琴, 等. 集成电路专业人才培养策略的研究. 电子世界, 2020, (1): 95-96. Peng X H, Wang S X, Geng S Q, et al. Research on training strategy of IC professionals. Electronics World, 2020, (1): 95-96. (in Chinese)

13 刘剑滨, 刘晨, 徐文轩, 等. 中国集成电路产业的人才培养策略研究. 集成电路应用, 2021, 38(2): 26-27. Liu J B, Liu C, Xu W X, et al. Study on talent training strategy of integrated circuit industry in China. Application of IC, 2021, 38(2): 26-27. (in Chinese)

Download
Request a Copy

Share

COinS